Submicron-Resolution, Large-Area, High-Throughput Patterning System for Electronic Modules
Summary:
With the help of BMDO-funded research, Anvik Corporation has developed a number of low-cost, large-area excimer laser patterning systems that feature both a higher resolution and a higher throughput than units now used. Anvik’s systems, which use a novel single planar technique to align the mask and substrate, can pattern lithographic features and form vias on a variety of electronic devices, such as flat-panel displays (FPDs), multichip modules (MCMs), printed circuit boards (PCBs), and microelectromechanical systems (MEMS). Thus far, the company has sold lithography systems used to manufacture electronics for cell phones, automobile applications, PCBs, and MCMS.
Technology Description:
Anvik Corporation (Hawthorne, NY) has developed a number of large-area laser lithography systems that can print submicron-resolution images (down to 0.5-0.7 microns) at a higher throughput and at a lower cost than traditional methods such as contact and proximity tools, conventional projection systems, steppers, scanners, and direct-write machines. The systems can pattern a variety of electronic products, such as flat-panel displays (FPDs), multichip modules (MCMs), printed circuit boards (PCBs) and microelectromechanical systems (MEMS).
With the ability to pattern up to 240 12'' x 12'' panels per hour at submicron resolution, the throughputs of Anvik's commercial systems are several times faster than existing lithography tools. In addition, tens of thousands of interconnect vias can be ablated each second. The systems can work on substrates as large as 24'' x 24'', with a variety of thicknesses and flexibilities.
The superior performance of Anvik’s systems is the result of several innovations, including: the single planar stage and hexagonal seamless scanning. The single planar stage is a technique for putting the lithography mask on the same plane as the substrate, which allows the mask and substrate to scan in unison, thereby eliminating the difficult and costly synchronization of separate positioning stages. Hexagonal seamless scanning uses an illumination system with an emission plane in the shape of a hexagon. Scanning with hexagonal illumination eliminates the “stitching errors” (errors caused by the misalignment of side-by-side exposure fields) that plague conventional projection and step-and-repeat imaging techniques. The approach also allows for larger scanning areas, which makes the technology superior to those techniques that have difficulties in achieving high resolution over large areas, such as contact printing, proximity printing, and conventional projection. The systems’ large depth of focus also eases substrate positioning requirements.
Anvik’s modular design of these systems can potentially lower cost of ownership. Integrating the systems’ main subsystem—the illumination module, the imaging module, and the stage module—in a non-interfering manner allows for easy upgrades and configuration. This flexibility would be especially attractive to companies that have to produce substrates of varying sizes, thicknesses, and flexibilities.
MDA Origins:
BMDO funded SBIR Phase I and II research into building a submicron-resolution, large-area, high-throughput patterning system for the production of electronic modules. BMDO was interested in shrinking the size and improving the performance of its electronic circuitry. Additional research funding was obtained from Defense Advanced Research Projects Agency, the Army, the Air Force, and the National Science Foundation.
Spinoff Applications:
Patterning systems of this sort would be highly attractive in manufacturing microelectronic modules, FPDs, communication electronics, MEMS systems, PCBs, flexible circuits, and other substrates where it is necessary to fabricate millions of microscopic structures. The patterning technology determines not only the density of a device's circuits, but also the price at which it can be done, given the lithography system’s level of throughput and yield. Thus, a system that offers a higher throughput and greater resolution can lower the price of consumer and industry electronics, while offering manufacturers the ability to add new features and increase performance.
Commercialization:
Thus far the company is selling a number of lithography systems to chip and electronic circuit makers based on the original BMDO research:
•HexScan 3100 SRE is a lithography system for flexible materials. This system is ideal for high-volume, low-cost production of flexible circuits, MCMs, and displays on flexible materials. It can have resolutions as low as 10 microns, and throughputs of up to 6 sq. feet per minute.
•HexScan 2050 SME is a large-panel high-resolution microlithography system. This system is ideal for high-volume production of high-density microelectronic modules, opto-electronic devices, and FPDs. It is capable of resolutions down to 5 microns and can work on panel sizes up to 24'' x 24'', with exposure throughputs of over 160 12'' x 12'' panels per hour. Plus the multiple exposure feature allows for prototyping of a wide-range of products.
•HexScan 2150 SXE is a large-format lithography system, designed for production of MCMs and PCBs. With a resolution of 15 microns, this machine can work on substrate sizes up to 18'' x 24'' and has a throughput of 160 12'' x 12'' panels per hour. This system is capable of both lithographic patterning and via generation by laser ablation.
•HexScan 2100 SPE is a lithography system designed for production of fine-line printed circuit boards. With a resolution of 10 microns, this machine can work on substrate sizes up to 18'' x 24'' and has a throughput of 6 sq. feet per minute. This system is also
available with anamorphic (independent) X-Y scaling capability, allowing users to compensate for dimensional changes in their substrates.
•Model 1010 SDE is a large area, high-resolution, high-throughput lithography system for FPDs. With a resolution as low as 1 micron, throughputs can be as high as a 100 10'' x 14'' panels per hour.
In general, these machines can meet or surpass leading-edge industry specifications for commercial resolution, which at present is approximately 2 mils for circuit manufacturers, 3 to5 microns for multichip modules, and 1 to 3 microns for flat-panel displays. An additional selling point for all these models is their low costs. In price, they can range, depending on model, customization, and automation, between $600,000 and $1.5 million, far less expensive than the $5 to $7 million for traditional stepper units.
Thus far the company has a number of models in the field. One customer is the Northfield, Minnesota-based Sheldahl, Inc., which has installed the 3100 SRE to manufacture flexible circuits for cell phone and automotive applications. Another customer is Acreo-Sweden, which uses the 2050 SME to develop the next generation of large-area, opto-electronic modules to be used in high-speed communication applications. The company has also collaborated with microelectronics research facilities such as the Georgia Institute of Technology’s Packaging Research Center, which has an Anvik lithography and ablation system.
Company Profile:
Anvik Corporation, founded in 1992, focuses on the design, development, and manufacturing of advanced optical systems and equipment for microelectronic, communications, and information technology applications. The company, which has 25 employees, is located in Westchester County, New York, and occupies a 12,000 sq. feet manufacturing and technical facility.
Contact Information:
Dr. Kanti Jain, President
Arvind Partha, Director of Marketing
Marc Zemel, Project Manager
Anvik Corporation
6 Skyline Drive
Hawthorne NY 10532
Tel:914-345-2442
Fax:914-345-2452
email: (Dr. Kanti Jain)
email: (Arvind Partha)
email: (Marc Zemel)
web: www.anvik.com
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