Dynamic Optical Interconnection
Summary:
New Span Opto-Technology Inc. (NSOT; Miami, FL) has developed a laser-writing technology that can be used to package optical interconnects. This technology uses dynamic optical alignment to package chips with waveguide components without physically moving them. This interconnect technology, when implemented in an opto-electronic packaging machine, could lower costs of optical interconnects for the electro-optic computing and fiber-optic telecommunications industries. NSOT is working on a prototype in partnership with the Canadian photonic component developer QPS Technology, Inc. A model should be finished by the end of 2001.
Technology Description:
New Span Opto-Technology Inc. (NSOT; Miami, FL) has developed a laser-writing technology that can be used to package optical interconnects.
Typically, it is difficult to attach polymer waveguide optical interconnects and other waveguide interconnect lines to opto-electronic transmitters and receivers, since the precision needed for optical alignment is very high. Also, alignments can not be tested before the package is finalized, since current production processes do not easily allow for activating and monitoring the components for testing. After the packaging in completed, optical alignment errors can not be easily corrected.
NSOT’s approach facilitates dynamic optical alignment of waveguides to opto-electronic components. The waveguides are made from a proprietary substrate that allows their refractive index to be controlled by a laser writing technique. Therefore, components can be assembled together first and then coupled. This dynamic optical alignment eliminates the need to physically move packaged chips and/or waveguide components. The waveguide substrate also allows for erasure and rewriting, facilitating interconnect line reconfiguration.
MDA Origins:
BMBO SBIR Phase II work was undertaken to produce a laser direct-write opto-electronic packaging machine for dynamic optical alignment of laser transmitter arrays, waveguide interconnect lines, and photodetector receiver arrays. Such a machine could produce low-cost optical interconnects for opto-electronic packaged computing systems.
Spinoff Applications:
This interconnect technology, when implemented in an opto-electronic packaging machine, can be the optical equivalent to a wire bonder for electronic component packaging. The costs of optical interconnects could be lowered through NSOT’s streamlined production process, which would dramatically improve yields and speed production times over current techniques.
Dynamically configured interconnects could provide a competitive edge in industries that employ photonic technologies. The nascent but promising field of high-speed opto-electronic computing, in which electronic computer components are augmented by photonic communications, could be commercially enabled by this technology. Also, manufacturers of wavelength division multiplexors, transceivers, and other fiber-optic telecommunications components would benefit from the higher yields and streamlined packaging of this technology.
Commercialization:
NSOT is working on an opto-electronic packaging prototype in partnership with the Canadian photonic component developer, QPS Technology, Inc. A model should be finished by the end of 2001.The company plans to initially market and/or license the technology to computer and chip manufacturers as well as to interconnect producers.
Company Profile:
New Span Opto-Technology Inc. was founded in 1997 and employs five people. Supported by various Federal research and development programs and partnerships with other companies, NSOT currently offers products in imaging, thin-film measurement, and photonics. The company also offers gray-level mask fabrication services and custom optical element fabrication services.
Contact Information:
Dr. Michael Wang
New Span Opto-Technology Inc.
93808 SW 72nd Sreet B-180
Miami FL 33173
Tel:305-275-6998
305-321-5288 (cellular)
Fax:305-275-6679
email: newspan@nsotech.com
web: www.nsotech.com
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